Printer assembly having flexible ink channel extrusion

ABSTRACT

An elastomeric ink delivery extrusion transports ink and air to printhead modules in an ink jet printhead assembly. A series of patterned holes are laser ablated onto an upper surface of the extrusion. These interface with inlets on the underside of a series of printhead modules of the assembly and relay ink and air from respective longitudinal channels of the extrusion.

CO-PENDING APPLICATIONS

[0001] Various methods, systems and apparatus relating to the presentinvention are disclosed in the following co-pending applications filedby the applicant or assignee of the present invention: 09/575,141,09/575,125, 09/575,108, 09/575,109.

[0002] The disclosures of these co-pending applications are incorporatedherein by reference.

BACKGROUND OF THE INVENTION

[0003] The following invention relates to a printhead assembly having aflexible ink channel extrusion for an ink jet printer.

[0004] More particularly though not exclusively the invention relates toa printhead assembly having a flexible ink channel extrusion for an A4pagewidth drop on demand printhead capable of printing up to 1600 dpiphotographic quality at up to 160 pages per minute.

[0005] The overall design of a printer in which the ink channelextrusion can be utilized revolves around the use of replaceableprinthead modules in an array approximately 8½ inches (21 cm) long. Anadvantage of such a system is the ability to easily remove and replaceany defective modules in a printhead array. This would eliminate havingto scrap an entire printhead if only one chip is defective.

[0006] A printhead module in such a printer can be comprised of a“Memjet” chip, being a chip having mounted thereon a vast number ofthermo-actuators in micro-mechanics and micro-electromechanical systems(MEMS). Such actuators might be those as disclosed in U.S. Pat. No.6,044,646 to the present applicant, however, might be other MEMS printchips.

[0007] In a typical embodiment, eleven “Memjet” tiles can butt togetherin a metal channel to form a complete 8½ inch printhead assembly.

[0008] The printhead, being the environment within which the ink channelof the present invention is to be situated, might typically have six inkchambers and be capable of printing four color process (CMYK) as well asinfra-red ink and fixative. An air pump would supply filtered airthrough a seventh chamber to the printhead, which could be used to keepforeign particles away from its ink nozzles.

[0009] Each printhead module receives ink via an elastomeric extrusionthat transfers the ink. Typically, the printhead assembly is suitablefor printing A4 paper without the need for scanning movement of theprinthead across the paper width.

[0010] The printheads themselves are modular, so printhead arrays can beconfigured to form printheads of arbitrary width.

[0011] Additionally, a second printhead assembly can be mounted on theopposite side of a paper feed path to enable double-sided high speedprinting.

OBJECTS OF THE INVENTION

[0012] It is the object of the present invention to provide a printheadassembly having a flexible ink channel extrusion for delivery of ink andpreferably air to an array of printhead modules situated along aprinthead assembly. It is a further object of the present invention toprovide a flexible ink channel extrusion for delivery of ink andpreferably air to an array of printhead modules secured within anelongate channel of a printhead assembly.

SUMMARY OF THE INVENTION

[0013] The present invention provides a printhead assembly for apagewidth drop on demand ink jet printer, comprising:

[0014] an array of printhead modules extending substantially across saidpagewidth, and

[0015] an ink delivery extrusion substantially coextensive with saidarray of printhead modules, the extrusion having a plurality of inkchannels for conveying discrete inks and a pattern of holes in a surfaceof the extrusion via which said discrete inks in said channels can passfrom the extrusion to each said printhead module.

[0016] Preferably said ink delivery extrusion also includes an airchannel for the delivery of air to the printhead modules.

[0017] Preferably said ink delivery extrusion is bonded onto a flexibleprinted circuit board.

[0018] Preferably an end of the ink delivery extrusion has a molded endcap fitted thereto, the end cap having a number of connectors to whichink and air delivery hoses can be connected.

[0019] Preferably each printhead module has a number of inlets havingannular rings to seal against said surface of the ink deliveryextrusion.

[0020] Preferably said ink extrusion is non-hydrophobic.

[0021] Preferably said holes in said surface of the extrusion are laserablated.

[0022] Preferably said end cap has a spine including a row of plugs thatare received within ends of the respective flow channels.

[0023] Preferably said end cap clamps onto the ink delivery extrusion byway of snap engagement tabs formed thereon.

[0024] Preferably said end cap includes connectors which interfacedirectly with an ink cartridge.

[0025] As used herein, the term “ink” is intended to mean any fluidwhich flows through the printhead to be delivered to print media. Thefluid may be one of many different colored inks, infra-red ink, afixative or the like.

BRIEF DESCRIPTION OF THE DRAWINGS

[0026] A preferred form of the present invention will now be describedby way of example with reference to the accompanying drawings wherein:

[0027]FIG. 1 is a schematic overall view of a printhead;

[0028]FIG. 2 is a schematic exploded view of the printhead of FIG. 1;

[0029]FIG. 3 is a schematic exploded view of an ink jet module;

[0030]FIG. 3a is a schematic exploded inverted illustration of the inkjet module of FIG. 3;

[0031]FIG. 4 is a schematic illustration of an assembled ink jet module;

[0032]FIG. 5 is a schematic inverted illustration of the module of FIG.4;

[0033]FIG. 6 is a schematic close-up illustration of the module of FIG.4;

[0034]FIG. 7 is a schematic illustration of a chip sub-assembly;

[0035]FIG. 8a is a schematic side elevational view of the printhead ofFIG. 1;

[0036]FIG. 8b is a schematic plan view of the printhead of FIG. 8a;

[0037]FIG. 8c is a schematic side view (other side) of the printhead ofFIG. 8a;

[0038]FIG. 8d is a schematic inverted plan view of the printhead of FIG.8b;

[0039]FIG. 9 is a schematic cross-sectional end elevational view of theprinthead of FIG. 1;

[0040]FIG. 10 is a schematic illustration of the printhead of FIG. 1 inan uncapped configuration;

[0041]FIG. 11 is a schematic illustration of the printhead of FIG. 10 ina capped configuration;

[0042]FIG. 12a is a schematic illustration of a capping device;

[0043]FIG. 12b is a schematic illustration of the capping device of FIG.12a, viewed from a different angle;

[0044]FIG. 13 is a schematic illustration showing the loading of an inkjet module into a printhead;

[0045]FIG. 14 is a schematic end elevational view of the printheadillustrating the printhead module loading method;

[0046]FIG. 15 is a schematic cut-away illustration of the printheadassembly of FIG. 1;

[0047]FIG. 16 is a schematic close-up illustration of a portion of theprinthead of FIG. 15 showing greater detail in the area of the “Memjet”chip;

[0048]FIG. 17 is a schematic illustration of the end portion of a metalchannel and a printhead location molding;

[0049]FIG. 18a is a schematic illustration of an end portion of anelastomeric ink delivery extrusion and a molded end cap; and

[0050]FIG. 18b is a schematic illustration of the end cap of FIG. 18a inan out-folded configuration.

DETAILED DESCRIPTION OF THE INVENTION

[0051] In FIG. 1 of the accompanying drawings there is schematicallydepicted an overall view of a printhead assembly. FIG. 2 shows the corecomponents of the assembly in an exploded configuration. The printheadassembly 10 of the preferred embodiment comprises eleven printheadmodules 11 situated along a metal “Invar” channel 16. At the heart ofeach printhead module 11 is a “Memjet” chip 23 (FIG. 3). The particularchip chosen in the preferred embodiment being a six-color configuration.

[0052] The “Memjet” printhead modules 11 are comprised of the “Memjet”chip 23, a fine pitch flex PCB 26 and two micromoldings 28 and 34sandwiching a mid-package film 35. Each module 11 forms a sealed unitwith independent ink chambers 63 (FIG. 9) which feed the chip 23. Themodules 11 plug directly onto a flexible elastomeric extrusion 15 whichcarries air, ink and fixitive. The upper surface of the extrusion 15 hasrepeated patterns of holes 21 which align with ink inlets 32 (FIG. 3a)on the underside of each module 11. The extrusion 15 is bonded onto aflex PCB (flexible printed circuit board).

[0053] The fine pitch flex PCB 26 wraps down the side of each printheadmodule 11 and makes contact with the flex PCB 17 (FIG. 9). The flex PCB17 carries two busbars 19 (positive) and 20 (negative) for powering eachmodule 11, as well as all data connections. The flex PCB 17 is bondedonto the continuous metal “Invar” channel 16. The metal channel 16serves to hold the modules 11 in place and is designed to have a similarcoefficient of thermal expansion to that of silicon used in the modules.

[0054] A capping device 12 is used to cover the “Memjet” chips 23 whennot in use. The capping device is typically made of spring steel with anonsert molded elastomeric pad 47 (FIG. 12a). The pad 47 serves to ductair into the “Memjet” chip 23 when uncapped and cut off air and cover anozzle guard 24 (FIG. 9) when capped. The capping device 12 is actuatedby a camshaft 13 that typically rotates throughout 180°.

[0055] The overall thickness of the “Memjet” chip is typically 0.6 mmwhich includes a 150 micron inlet backing layer 27 and a nozzle guard 24of 150 micron thickness. These elements are assembled at the waferscale.

[0056] The nozzle guard 24 allows filtered air into an 80 micron cavity64 (FIG. 16) above the “Memjet” ink nozzles 62. The pressurized airflows through microdroplet holes 45 in the nozzle guard 24 (with the inkduring a printing operation) and serves to protect the delicate “Memjet”nozzles 62 by repelling foreign particles.

[0057] A silicon chip backing layer 27 ducts ink from the printheadmodule packaging directly into the rows of “Memjet” nozzles 62. The“Memjet” chip 23 is wire bonded 25 from bond pads on the chip at 116positions to the fine pitch flex PCB 26. The wire bonds are on a 120micron pitch and are cut as they are bonded onto the fine pitch flex PCBpads (FIG. 3). The fine pitch flex PCB 26 carries data and power fromthe flex PCB 17 via a series of gold contact pads 69 along the edge ofthe flex PCB.

[0058] The wire bonding operation between chip and fine pitch flex PCB26 may be done remotely, before transporting, placing and adhering thechip assembly into the printhead module assembly. Alternatively, the“Memjet” chips 23 can be adhered into the upper micromolding 28 firstand then the fine pitch flex PCB 26 can be adhered into place. The wirebonding operation could then take place in situ, with no danger ofdistorting the moldings 28 and 34. The upper micromolding 28 can be madeof a Liquid Crystal Polymer (LCP) blend. Since the crystal structure ofthe upper micromolding 28 is minute, the heat distortion temperature(180° C.-260° C.), the continuous usage temperature (200° C.-240° C.)and soldering heat durability (260° C. for 10 seconds to 310° C. for 10seconds) are high, regardless of the relatively low melting point.

[0059] Each printhead module 11 includes an upper micromolding 28 and alower micromolding 34 separated by a mid-package film layer 35 shown inFIG. 3.

[0060] The mid-package film layer 35 can be an inert polymer such aspolyimide, which has good chemical resistance and dimensional stability.The mid-package film layer 35 can have laser ablated holes 65 and cancomprise a double-sided adhesive (ie. an adhesive layer on both faces)providing adhesion between the upper micromolding, the mid-package filmlayer and the lower micromolding.

[0061] The upper micromolding 28 has a pair of alignment pins 29 passingthrough corresponding apertures in the mid-package film layer 35 to bereceived within corresponding recesses 66 in the lower micromolding 34.This serves to align the components when they are bonded together. Oncebonded together, the upper and lower micromoldings form a tortuous inkand air path in the complete “Memjet” printhead module 11.

[0062] There are annular ink inlets 32 in the underside of the lowermicromolding 34. In a preferred embodiment, there are six such inlets 32for various inks (black, yellow, magenta, cyan, fixitive and infrared).There is also provided an air inlet slot 67. The air inlet slot 67extends across the lower micromolding 34 to a secondary inlet whichexpels air through an exhaust hole 33, through an aligned hole 68 infine pitch flex PCB 26. This serves to repel the print media from theprinthead during printing. The ink inlets 32 continue in theundersurface of the upper micromolding 28 as does a path from the airinlet slot 67. The ink inlets lead to 200 micron exit holes alsoindicated at 32 in FIG. 3. These holes correspond to the inlets on thesilicon backing layer 27 of the “Memjet” chip 23.

[0063] There is a pair of elastomeric pads 36 on an edge of the lowermicromolding 34. These serve to take up tolerance and positively locatedthe printhead modules 11 into the metal channel 16 when the modules aremicro-placed during assembly.

[0064] A preferred material for the “Memjet” micromoldings is a LCP.This has suitable flow characteristics for the fine detail in themoldings and has a relatively low coefficient of thermal expansion.

[0065] Robot picker details are included in the upper micromolding 28 toenable accurate placement of the printhead modules 11 during assembly.

[0066] The upper surface of the upper micromolding 28 as shown in FIG. 3has a series of alternating air inlets and outlets 31. These act inconjunction with the capping device 12 and are either sealed off orgrouped into air inlet/outlet chambers, depending upon the position ofthe capping device 12. They connect air diverted from the inlet slot 67to the chip 23 depending upon whether the unit is capped or uncapped.

[0067] A capper cam detail 40 including a ramp for the capping device isshown at two locations in the upper surface of the upper micromolding28. This facilitates a desirable movement of the capping device 12 tocap or uncap the chip and the air chambers. That is, as the cappingdevice is caused to move laterally across the print chip during acapping or uncapping operation, the ramp of the capper cam detail 40serves to elastically distort and capping device as it is moved byoperation of the camshaft 13 so as to prevent scraping of the deviceagainst the nozzle guard 24.

[0068] The “Memjet” chip assembly 23 is picked and bonded into the uppermicromolding 28 on the printhead module 11. The fine pitch flex PCB 26is bonded and wrapped around the side of the assembled printhead module11 as shown in FIG. 4. After this initial bonding operation, the chip 23has more sealant or adhesive 46 applied to its long edges. This servesto “pot” the bond wires 25 (FIG. 6), seal the “Memjet” chip 23 to themolding 28 and form a sealed gallery into which filtered air can flowand exhaust through the nozzle guard 24.

[0069] The flex PCB 17 carries all data and power connections from themain PCB (not shown) to each “Memjet” printhead module 11. The flex PCB17 has a series of gold plated, domed contacts 69 (FIG. 2) whichinterface with contact pads 41, 42 and 43 on the fine pitch flex PCB 26of each “Memjet” printhead module 11.

[0070] Two copper busbar strips 19 and 20, typically of 200 micronthickness, are jigged and soldered into place on the flex PCB 17. Thebusbars 19 and 20 connect to a flex termination which also carries data.

[0071] The flex PCB 17 is approximately 340 mm in length and is formedfrom a 14 mm wide strip. It is bonded into the metal channel 16 duringassembly and exits from one end of the printhead assembly only.

[0072] The metal U-channel 16 into which the main components are placeis of a special alloy called “Invar 36”. It is a 36% nickel iron alloypossessing a coefficient of thermal expansion of 1/10^(th) that ofcarbon steel at temperatures up to 400° F. The Invar is annealed foroptimal dimensional stability.

[0073] Additionally, the Invar is nickel plated to a 0.056% thickness ofthe wall section. This helps to further match it to the coefficient ofthermal expansion of silicon which is 2×10⁻⁶ per ° C.

[0074] The Invar channel 16 functions to capture the “Memjet” printheadmodules 11 in a precise alignment relative to each other and to impartenough force on the modules 11 so as to form a seal between the inkinlets 32 on each printhead module and the outlet holes 21 that arelaser ablated into the elastomeric ink delivery extrusion 15.

[0075] The similar coefficient of thermal expansion of the Invar channelto the silicon chips allows similar relative movement during temperaturechanges. The elastomeric pads 36 on one side of each printhead module 11serve to “lubricate” them within the channel 16 to take up any furtherlateral coefficient of thermal expansion tolerances without losingalignment. The Invar channel is a cold rolled, annealed and nickelplated strip. Apart from two bends that are required in its formation,the channel has two square cutouts 80 at each end. These mate with snapfittings 81 on the printhead location moldings 14 (FIG. 17).

[0076] The elastomeric ink delivery extrusion 15 is a non-hydrophobic,precision component. Its function is to transport ink and air to the“Memjet” printhead modules 11. The extrusion is bonded onto the top ofthe flex PCB 17 during assembly and it has two types of molded end caps.One of these end caps is shown at 70 in FIG. 18a.

[0077] A series of patterned holes 21 are present on the upper surfaceof the extrusion 15. These are laser ablated into the upper surface. Tothis end, a mask is made and placed on the surface of the extrusion,which then has focused laser light applied to it. The holes 21 areevaporated from the upper surface, but the laser does not cut into thelower surface of extrusion 15 due to the focal length of the laserlight.

[0078] Eleven repeated patterns of the laser ablated holes 21 form theink and air outlets 21 of the extrusion 15. These interface with theannular ring inlets 32 on the underside of the “Memjet” printhead modulelower micromolding 34. A different pattern of larger holes (not shownbut concealed beneath the upper plate 71 of end cap 70 in FIG. 18a) isablated into one end of the extrusion 15. These mate with apertures 75having annular ribs formed in the same way as those on the underside ofeach lower micromolding 34 described earlier. Ink and air delivery hoses78 are connected to respective connectors 76 that extend from the upperplate 71. Due to the inherent flexibility of the extrusion 15, it cancontort into many ink connection mounting configurations withoutrestricting ink and air flow. The molded end cap 70 has a spine 73 fromwhich the upper and lower plates are integrally hinged. The spine 73includes a row of plugs 74 that are received within the ends of therespective flow passages of the extrusion 15.

[0079] The other end of the extrusion 15 is capped with simple plugswhich block the channels in a similar way as the plugs 74 on spine 17.

[0080] The end cap 70 clamps onto the ink extrusion 15 by way of snapengagement tabs 77. Once assembled with the delivery hoses 78, ink andair can be received from ink reservoirs and an air pump, possibly withfiltration means. The end cap 70 can be connected to either end of theextrusion, ie. at either end of the printhead.

[0081] The plugs 74 are pushed into the channels of the extrusion 15 andthe plates 71 and 72 are folded over. The snap engagement tabs 77 clampthe molding and prevent it from slipping off the extrusion. As theplates are snapped together, they form a sealed collar arrangementaround the end of the extrusion. Instead of providing individual hoses78 pushed onto the connectors 76, the molding 70 might interfacedirectly with an ink cartridge. A sealing pin arrangement can also beapplied to this molding 70. For example, a perforated, hollow metal pinwith an elastomeric collar can be fitted to the top of the inletconnectors 76. This would allow the inlets to automatically seal with anink cartridge when the cartridge is inserted. The air inlet and hosemight be smaller than the other inlets in order to avoid accidentalcharging of the airways with ink.

[0082] The capping device 12 for the “Memjet” printhead would typicallybe formed of stainless spring steel. An elastomeric seal or onsertmolding 47 is attached to the capping device as shown in FIGS. 12a and12 b. The metal part from which the capping device is made is punched asa blank and then inserted into an injection molding tool ready for theelastomeric onsert to be shot onto its underside. Small holes 79 (FIG.13b) are present on the upper surface of the metal capping device 12 andcan be formed as burst holes. They serve to key the onsert molding 47 tothe metal. After the molding 47 is applied, the blank is inserted into apress tool, where additional bending operations and forming of integralsprings 48 takes place.

[0083] The elastomeric onsert molding 47 has a series of rectangularrecesses or air chambers 56. These create chambers when uncapped. Thechambers 56 are positioned over the air inlet and exhaust holes 30 ofthe upper micromolding 28 in the “Memjet” printhead module 11. Theseallow the air to flow from one inlet to the next outlet. When thecapping device 12 is moved forward to the “home” capped position asdepicted in FIG. 11, these airways 32 are sealed off with a blanksection of the onsert molding 47 cutting off airflow to the “Memjet”chip 23. This prevents the filtered air from drying out and thereforeblocking the delicate “Memjet” nozzles.

[0084] Another function of the onsert molding 47 is to cover and clampagainst the nozzle guard 24 on the “Memjet” chip 23. This protectsagainst drying out, but primarily keeps foreign particles such as paperdust from entering the chip and damaging the nozzles. The chip is onlyexposed during a printing operation, when filtered air is also exitingalong with the ink drops through the nozzle guard 24. This positive airpressure repels foreign particles during the printing process and thecapping device protects the chip in times of inactivity.

[0085] The integral springs 48 bias the capping device 12 away from theside of the metal channel 16. The capping device 12 applies acompressive force to the top of the printhead module 11 and theunderside of the metal channel 16. The lateral capping motion of thecapping device 12 is governed by an eccentric camshaft 13 mountedagainst the side of the capping device. It pushes the device 12 againstthe metal channel 16. During this movement, the bosses 57 beneath theupper surface of the capping device 12 ride over the respective ramps 40formed in the upper micromolding 28. This action flexes the cappingdevice and raises its top surface to raise the onsert molding 47 as itis moved laterally into position onto the top of the nozzle guard 24.

[0086] The camshaft 13, which is reversible, is held in position by twoprinthead location moldings 14. The camshaft 11 can have a flat surfacebuilt in one end or be otherwise provided with a spline or keyway toaccept gear 22 or another type of motion controller.

[0087] The “Memjet” chip and printhead module are assembled as follows:

[0088] 1. The “Memjet” chip 23 is dry tested in flight by a pick andplace robot, which also dices the wafer and transports individual chipsto a fine pitch flex PCB bonding area.

[0089] 2. When accepted, the “Memjet” chip 23 is placed 530 micronsapart from the fine pitch flex PCB 26 and has wire bonds 25 appliedbetween the bond pads on the chip and the conductive pads on the finepitch flex PCB. This constitutes the “Memjet” chip assembly.

[0090] 3. An alternative to step 2 is to apply adhesive to the internalwalls of the chip cavity in the upper micromolding 28 of the printheadmodule and bond the chip into place first. The fine pitch flex PCB 26can then be applied to the upper surface of the micromolding and wrappedover the side. Wire bonds 25 are then applied between the bond pads onthe chip and the fine pitch flex PCB.

[0091] 4. The “Memjet” chip assembly is vacuum transported to a bondingarea where the printhead modules are stored.

[0092] 5. Adhesive is applied to the lower internal walls of the chipcavity and to the area where the fine pitch flex PCB is going to belocated in the upper micromolding of the printhead module.

[0093] 6. The chip assembly (and fine pitch flex PCB) are bonded intoplace. The fine pitch flex PCB is carefully wrapped around the side ofthe upper micromolding so as not to strain the wire bonds. This may beconsidered as a two step gluing operation if it is deemed that the finepitch flex PCB might stress the wire bonds. A line of adhesive runningparallel to the chip can be applied at the same time as the internalchip cavity walls are coated. This allows the chip assembly and finepitch flex PCB to be seated into the chip cavity and the fine pitch flexPCB allowed to bond to the micromolding without additional stress. Aftercuring, a secondary gluing operation could apply adhesive to the shortside wall of the upper micromolding in the fine pitch flex PCB area.This allows the fine pitch flex PCB to be wrapped around themicromolding and secured, while still being firmly bonded in place alongon the top edge under the wire bonds.

[0094] 7. In the final bonding operation, the upper part of the nozzleguard is adhered to the upper micromolding, forming a sealed airchamber. Adhesive is also applied to the opposite long edge of the“Memjet” chip, where the bond wires become ‘potted’ during the process.

[0095] 8. The modules are ‘wet’ tested with pure water to ensurereliable performance and then dried out.

[0096] 9. The modules are transported to a clean storage area, prior toinclusion into a printhead assembly, or packaged as individual units.The completes the assembly of the “Memjet” printhead module assembly.

[0097] 10. The metal Invar channel 16 is picked and placed in a jig.

[0098] 11. The flex PCB 17 is picked and primed with adhesive on thebusbar side, positioned and bonded into place on the floor and one sideof the metal channel.

[0099] 12. The flexible ink extrusion 15 is picked and has adhesiveapplied to the underside. It is then positioned and bonded into place ontop of the flex PCB 17. One of the printhead location end caps is alsofitted to the extrusion exit end. This constitutes the channel assembly.

[0100] The laser ablation process is as follows:

[0101] 13. The channel assembly is transported to an eximir laserablation area.

[0102] 14. The assembly is put into a jig, the extrusion positioned,masked and laser ablated. This forms the ink holes in the upper surface.

[0103] 15. The ink extrusion 15 has the ink and air connector molding 70applied. Pressurized air or pure water is flushed through the extrusionto clear any debris.

[0104] 16. The end cap molding 70 is applied to the extrusion 15. It isthen dried with hot air.

[0105] 17. The channel assembly is transported to the printhead modulearea for immediate module assembly. Alternatively, a thin film can beapplied over the ablated holes and the channel assembly can be storeduntil required.

[0106] The printhead module to channel is assembled as follows:

[0107] 18. The channel assembly is picked, placed and clamped into placein a transverse stage in the printhead assembly area.

[0108] 19. As shown in FIG. 14, a robot tool 58 grips the sides of themetal channel and pivots at pivot point against the underside face toeffectively flex the channel apart by 200 to 300 microns. The forcesapplied are shown generally as force vectors F in FIG. 14. This allowsthe first “Memjet” printhead module to be robot picked and placed(relative to the first contact pads on the flex PCB 17 and ink extrusionholes) into the channel assembly.

[0109] 20. The tool 58 is relaxed, the printhead module captured by theresilience of the Invar channel and the transverse stage moves theassembly forward by 19.81 mm.

[0110] 21. The tool 58 grips the sides of the channel again and flexesit apart ready for the next printhead module.

[0111] 22. A second printhead module 11 is picked and placed into thechannel 50 microns from the previous module.

[0112] 23. An adjustment actuator arm locates the end of the secondprinthead module. The arm is guided by the optical alignment offiducials on each strip. As the adjustment arm pushes the printheadmodule over, the gap between the fiducials is closed until they reach anexact pitch of 19.812 mm.

[0113] 24. The tool 58 is relaxed and the adjustment arm is removed,securing the second printhead module in place.

[0114] 25. This process is repeated until the channel assembly has beenfully loaded with printhead modules. The unit is removed from thetransverse stage and transported to the capping assembly area.Alternatively, a thin film can be applied over the nozzle guards of theprinthead modules to act as a cap and the unit can be stored asrequired.

[0115] The capping device is assembled as follows:

[0116] 26. The printhead assembly is transported to a capping area. Thecapping device 12 is picked, flexed apart slightly and pushed over thefirst module 11 and the metal channel 16 in the printhead assembly. Itautomatically seats itself into the assembly by virtue of the bosses 57in the steel locating in the recesses 83 in the upper micromolding inwhich a respective ramp 40 is located.

[0117] 27. Subsequent capping devices are applied to all the printheadmodules.

[0118] 28. When completed, the camshaft 13 is seated into the printheadlocation molding 14 of the assembly. It has the second printheadlocation molding seated onto the free end and this molding is snappedover the end of the metal channel, holding the camshaft and cappingdevices captive.

[0119] 29. A molded gear 22 or other motion control device can be addedto either end of the camshaft 13 at this point.

[0120] 30. The capping assembly is mechanically tested.

[0121] Print charging is as follows:

[0122] 31. The printhead assembly 10 is moved to the testing area. Inksare applied through the “Memjet” modular printhead under pressure. Airis expelled through the “Memjet” nozzles during priming. When charged,the printhead can be electrically connected and tested.

[0123] 32. Electrical connections are made and tested as follows:

[0124] 33. Power and data connections are made to the PCB. Final testingcan commence, and when passed, the “Memjet” modular printhead is cappedand has a plastic sealing film applied over the underside that protectsthe printhead until product installation.

We claim
 1. A printhead assembly for a pagewidth drop on demand ink jetprinter, comprising: an array of printhead modules extendingsubstantially across said pagewidth, and an ink delivery extrusionsubstantially coextensive with said array of printhead modules, theextrusion having a plurality of ink channels for conveying discrete inksand a pattern of holes in a surface of the extrusion via which saiddiscrete inks in said channels can pass from the extrusion to each saidprinthead module.
 2. The assembly of claim 1 wherein said ink deliveryextrusion also includes an air channel for the delivery of air to theprinthead modules.
 3. The assembly of claim 1 wherein said ink deliveryextrusion is bonded onto a flexible printed circuit board.
 4. Theassembly of claim 1 wherein an end of the ink delivery extrusion has amolded end cap fitted thereto, the end cap having a number of connectorsto which ink and air delivery hoses can be connected.
 5. The assembly ofclaim 1 wherein each printhead module has a number of inlets havingannular rings to seal against said surface of the ink deliveryextrusion.
 6. The assembly of claim 1 wherein said ink extrusion isnon-hydrophobic.
 7. The assembly of claim 1 wherein said holes in saidsurface of the extrusion are laser ablated.
 8. The assembly of claim 4wherein said end cap has a spine including a row of plugs that arereceived within ends of the respective flow channels.
 9. The assembly ofclaim 8 wherein said end cap clamps onto the ink delivery extrusion byway of snap engagement tabs formed thereon.
 10. The assembly of claim 4wherein said end cap includes connectors which interface directly withan ink cartridge.